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MiniONE Pro

MiniONE Pro

The most sensitive sensor Bota Systems ever built: 10 mN resolution at 60 g. I led the mechanical design of MiniONE Pro for micro-assembly, optical alignment, and semiconductor face-matching applications where sub-Newton precision is required. Winner of the EPDT Design Award 2023.

Mechanical Design Engineer
Nov 2021 – Aug 2023
2 min read
SolidWorksFEAGD&TDFAEtherCATPLM

Product Design

At 60 g with 10 mN resolution and up to 2000 Hz sampling, the MiniONE Pro is the most sensitive packaged force-torque sensor Bota Systems has shipped. I designed the dustproof, water-resistant casing with embedded electronics, a 6-DOF IMU, and temperature sensors, and made it plug-and-play compatible with Yaskawa MotoMini and Mecademic Meca500 for drop-in deployment in precision robotics cells.

MiniONE Pro assembled with dustproof casing
MiniONE Pro bare sensing element

PLM & Manufacturing

Built the company's PLM infrastructure from scratch, SolidWorks PDM to ERP: data integrity, ECO/ECR-controlled change management, and clean design transfer to contract manufacturers. Applied design-for-assembly principles that cut assembly time by 40%+, and designed automated jigs and end-of-line testing stations for consistent measurement quality at production scale.

MiniONE Pro mounted on Mecademic Meca500 robot

10 mN

Resolution

60 g

Sensor Mass

40%+

Assembly Time Cut

Challenges

  • At 60 g there is almost no thermal mass, so even small temperature changes affect strain gauge readings. Compensating for that while embedding a 6-DOF IMU and temperature sensors required very tight packaging.
  • Production consistency was the real constraint: every unit had to meet the same 10 mN spec. Scaling from hand-built prototypes to series production meant designing the manufacturing process in parallel with the product.

Outcomes

  • EPDT Design Award 2023. Adopted by global robotics teams, universities, and semiconductor fabs.
  • Deployed in optical alignment, semiconductor pick-and-place, and laser component face-matching at companies previously using sensors costing several times more.
  • DFA redesign cut assembly time by 40%+, making the product commercially viable at volume.